CMSE Conference 2024 | Components for Military & Space Electronics Conference

CMSE 2024 RECAP

CMSE 2024 TUTORIALS

APRIL 30

Tuesday

MICROELECTRONIC COMPONENT ENGINEERING FOR THE 2020^s

Instructors: Ron Demcko (Kyocera/AVX), Trevor Devaney (Hi-Rel Laboratories), Jon Rhan (VISHAY), Thomas J Green (TJ Green Associates)

Heterogeneous Integration Packaging Reliability Challenges and Roadmap

Preview Presentation Notes

Instructor: Richard Rao, Ph. D. (Marvell Technology) Co-Chair IEEE HIR Reliability TWG

UNDERSTANDING THE MILITARY STANDARDS AND UPDATE ON JEDEC AND NEW SPEC INITIATIVES

Preview Presentation Notes

Instructors: Lawrence Harzstark (Aerospace Corp.), Sultan Lilani (Integra Technologies), Shri Agarwal (NASA Jet Propulsion Laboratory), Rod De Leon (Boeing Corporation)

CMSE 2024 TECHNICAL PROGRAM

MAY 1

Wednesday

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Wafer-level Packaging (WLP) Reliability and Stress Driven Failure Modes

Kaysar Rahim (Northrop Grumman)

Introducing a Patented Ceramic Capacitor for Next Gen RF & Microwave

Scott Cooper (Quantic Eulex)

Reliability and Quality of Off-chip Interconnects in Advanced Packages in Perspective of High-Reliability Space Applications

Eric Suh (NASA JPL)

IBM Advanced Packaging in the Northeast Corridor

Julian Warchall, Ph.D. (IBM)

Reducing Board Surface Area and Improving RF Performance by Embedding Ultra-Thin Capacitors

Ryan Messina (Kyocera/AVX)

Heterogenous Integration in Complex Integrated Microelectronics Systems

Richard Otte (Promex)

KEYNOTE: Future Microsystems for Extreme Environments

Carl E. McCants, Ph. D. (DARPA)
Special Assistant to the Director, Defense Advanced Research Projects Agency (DARPA) for Microelectronics Policy

Joint SAE/JEDEC Power GaN and SiC Working Group Presentation

Rod de Leon (Boeing)

Categorization, Developments, and Selection for Thermal Interface Materials

David Saums (DS&A)

Testing Methodologies and Test Systems for Thermal Interface Materials

David Saums (DS&A)

Hybrid Inspection and Assembly Process Related Challenges

Aaron Dermarderosian (Collins Aerospace/RTX)

Time Dependent Capacitance Drift of X7R MLCCs Under Exposure

Brian Ward (Vishay)

Countering Threats from Transients in Magnetics

Victor Quinn (Exxelia)

The Benefits of High-Reliability in Polymer Tantalum Capacitors

Dr. James Turner (Yageo)

High Energy, High Density Tantalum Capacitors for High Reliability Applications

Jon Rhan (Vishay)

MAY 2

Thursday

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KEYNOTE: The Critical Needs of a Resilient Industrial Base

David L. Beck (SpaceForce)
Branch Chief for Capability Assessment and Principal for Space (Logistics) Industrial Base for the Space Systems Integration Office, Space Systems Command (SSC), Los Angeles Air Force Base, CA

Active Packaging for Electronic Components and Assemblies

Tony Casasnovas (Honeywell)

An Alternate COTS Approach for Space Missions

Susana Douglas (NASA Goddard NEPP)

COTS Power supply ESS Vibration failures

Aaron Dermarderosian (Collins Aerospace/RTX)

An update on non-hermetic Tantalum Polymer Capacitor Performance

Ron Demko (Kyocera/AVX)

Lessons learned on buying commercial off the shelf products for up screening

Ben Mendoza (Golden Altos)

COTS Mission Success Improvement Workshop Results

Dr. Ryan Rairigh (Lockheed Martin)

ALTERNATE GRADE PARTS PANEL DISCUSSION (45 MIN)

Panelists: Pete Majewicz (NASA GSFC), Larry Harzstark (Aerospace Corp), Dr. Ryan Rairigh (Lockheed Martin Space), Mark Porter (NASA/JPL)

Moderator: Sultan Lilani (Integra Technologies)

Hear from the experts and join us in an open discussion on how to bring into focus divergent views on the use of alternate grade parts for military and space applications.

Gap Analysis of COTS style EIA-364 standards to MIL-DTL-55302: What is needed and can be done for up screening Interconnects

John Riley (Samtec)