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CMSE 2024 TECHNICAL PRESENTATIONS

Wafer-level Packaging (WLP) Reliability and Stress Driven Failure Modes

Kaysar Rahim (Northrop Grumman)

Introducing a Patented Ceramic Capacitor for Next Gen RF & Microwave

Scott Cooper (Quantic Eulex)

Reliability and Quality of Off-chip Interconnects in Advanced Packages in Perspective of High-Reliability Space Applications

Eric Suh (NASA JPL)

IBM Advanced Packaging in the Northeast Corridor

Julian Warchall, Ph.D. (IBM)

Reducing Board Surface Area and Improving RF Performance by Embedding Ultra-Thin Capacitors

Ryan Messina (Kyocera/AVX)

Heterogenous Integration in Complex Integrated Microelectronics Systems

Richard Otte (Promex)

Heterogeneous Integration Roadmap

Richard Rao (Marvell)

Joint SAE/JEDEC Power GaN and SiC Working Group Presentation

Rod de Leon (Boeing)

Categorization, Developments, and Selection for Thermal Interface Materials

David Saums (DS&A)

Testing Methodologies and Test Systems for Thermal Interface Materials

David Saums (DS&A)

Hybrid Inspection and Assembly Process Related Challenges

Aaron Dermarderosian (Collins Aerospace/RTX)
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Time Dependent Capacitance Drift of X7R MLCCs Under Exposure

Brian Ward (Vishay)
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Countering Threats from Transients in Magnetics

Victor Quinn (Exxelia)
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The Benefits of High-Reliability in Polymer Tantalum Capacitors

Dr. James Turner (Yageo)
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High Energy, High Density Tantalum Capacitors for High Reliability Applications

Jon Rhan (Vishay)

Active Packaging for Electronic Components and Assemblies

Tony Casasnovas (Honeywell)

An Alternate COTS Approach for Space Missions

Susana Douglas (NASA Goddard NEPP)

COTS Power supply ESS Vibration failures

Aaron Dermarderosian (Collins Aerospace/RTX)

An update on non-hermetic Tantalum Polymer Capacitor Performance

Ron Demko (Kyocera/AVX)

Lessons learned on buying commercial off the shelf products for up screening

Ben Mendoza (Golden Altos)

COTS Mission Success Improvement Workshop Results

Dr. Ryan Rairigh (Lockheed Martin)

Gap Analysis of COTS style EIA-364 standards to MIL-DTL-55302: What is needed and can be done for up screening Interconnects

John Riley (Samtec)

Standardized Outgassing Characterization Capability: TML & CVCM Determination via ASTM E595

Jayeshkumar Das (Oneida Research Services, Inc.)

Precision Automation in Hermetic Package Sealing

Herman Itzkowitz (MicroCircuit Laboratories LLC)

The Numbers Crunch A Novel Approach to Transparency, Trust, and Assurance in Microelectronic Supply Chains

Richard Smith (ERAI)

Golden Samples for Counterfeit Mitigation

Lam Nguyen (chipsID)

Dendritic Identifiers

Michael N. Kozicki (Densec ID, LLC & Arizona State University)

VPT Component’s Development of Radiation Hardened MOSFETs with LA Semiconductor

Joseph Benedetto (VPT Components)

QML-P: The latest standard for radiation-hardened, plastic space packaging

Javier Valle (Texas Instruments)

Microprocessor Reliability Enhancement Under Ionizing Radiation Using Performance Counters

Antonio E. Teijeiro (UTEP)