CMSE 2026 KEYNOTE - DAY 1
Microelectronics: Critical Enabler for Innovation in Commercial and Military Systems
Devanand K. Shenoy, Ph.D. (IBM Research)
SESSION 1A
DLA Standards and Specifications Benefit the Military and Space Users’ Community
Muhammad Akbar (Defense Logistics Agency - DLA)
ESCC evolution: Enhanced Grade Component for improving the availability of strategic EEE component in Europe
Denis Lacombe (ESA - European Space Agency)
Using AEC-Q Semiconductors in Military and Aerospace Applications
Kevin Parmenter (Taiwan Semiconductor)
MLCC Product Grades Explained: From Commercial to Space Applications
Tyler Lagnese (Kyocera/AVX)
LUNCH & LEARN SPEAKER
SESSION 1B
COTS Integration: Success & Challenges in Mission Critical Systems
Aaron C. Dermarderosian (Collins Aerospace)
Solder Column Reliability in Extreme Cold
Marty Hart (TopLine)
BGA Reballing for Mission-Critical Applications
Minerva Cruz (Six Sigma Microelectronics)
Innovative Ceramic Sub-Mounts and Heat Spreaders
Chandra Gupta, PhD (Remtec)
Critical Improvements in Thermal Materials and Characterization Tools for TIMs
Dave Saums (DS&A LLC)
Thermal Management at the Component and Board Level
Bruce Guldin (Vishay)
Selection, Metrology Controls and Reliability Performance of Thermal Interface Materials (TIM) in Advanced 3D Package Designs
Dr. Christo Bojkov (The University of Texas at Dallas), Joana Catarina Mendes (Institute for Telecommunications), Bill Ishii (Sumitomo Thermal Materials ALMT)
When the Interconnectedness of Systems, Goes Awry
Aaron C. Dermarderosian (Collins Aerospace)
CMSE KEYNOTE - DAY 2
Ultra-Low Loss & Precision Passive Components for Quantum Computing: Market Opportunities & Technology
Dennis M. Zogbi (Paumanok)
SESSION 2A
Limitations in Today’s Passive Electrical Components
Dr. Eric Langlois (BAE Systems)
Low Inductance Bulk Capacitors
Ron Demcko, Allen Maya, Daniel West, Joe Hock (Kyocera/AVX)
New High Voltage Reconstituted Mica Capacitors to Pulse or Filter in One Small SMD Package
Jimmy Duwattez & Mickael Dubois (Exxelia)
Eliminating Wirebonds in RF Modules: A New Class of Low-ESL Capacitors
Mark Simpson (UTC & Eulex - Evans Group)
Why Capacitors Do What They Do
David Zawacki (CalRamic Technologies)
Wire Bonding and Ultrasonic Smart Welding for Space Applications
Mike McKeown, Ph.D. (Hesse Mechatronics)
From Spaceflight to EUV Lithography: High Reliability Outgassing and RGA Testing
Jayeshkumar Das (Oneida Research Services)
SESSION 2B
IBM: Pioneering Emerging Compute
Julian Warchall, Ph.D. (IBM)
Bridging the Reliability Chasm: Applying AI-Driven Predictive Forensics to Qualify Electronics for Military & Space Environments
Eisuke Tsuyuzaki (Bayflex Solutions)
Achieving High‑Reliability Semiconductor Components Production in a Fully Outsourced Manufacturing Mode
Don Larson (Eastern States Components)
An Introduction to Laser Trimming A Measurement-Driven Process
Jim Greene (Photonics Systems USA)
Integrated Thin-Film Resistor Materials for High-Frequency Applications
John Andresakis (Ohmega Ticer)
Scaling National Security: The SCALE Program’s Role in Growing the Nation’s Skilled Microelectronics Workforce
Peggy E. Williams, Ph.D. (NSWC Crane)
Die Solutions for Space Constrained Hybrid Applications
Joe Beck (Central Semiconductor)
The Design of Ultra Narrow-Band Amplifiers for High Sensitivity Receiver Front-Ends Using Negative Resistance Devices for ESM, ECM, ECCM, ELINT, Radar, Satellite & Telecommunication Applications
Dr Ash (Ashok) Gorwara (Gorwara & Associates International, Inc)
A RadHard Logic Level MOSFET for Military and Space Applications
Joe Benedetto, Mark McNulla and Mehrdad Namin (VPT Components)
CUI/CMMC/ITAR COMPLIANCE FOR FEDERAL GOVERNMENT CONTRACTORS
Alan Sugano (ADS Consulting Group)
John R. Devaney Award
BEST PRESENTATION
BGA Reballing for Mission-Critical Applications
Minerva Cruz (Six Sigma Microelectronics)
