Devanand K. Shenoy, Ph.D.
Strategic Advisor to IBM Semiconductors (IBM Research)
Talk Title:
Microelectronics: Critical Enabler for Innovation
in Commercial and Military Systems
Semiconductors underpin virtually every product and system that commercial industry and the U.S. military use. Next-generation microelectronics technologies create asymmetric capabilities for the warfighter. Commercial industry’s microelectronics enable system-level product opportunities in numerous market verticals. Most military systems are unique, demand bespoke microelectronics capabilities for operation in harsh environments and adequate security of the chips and systems they are embedded in. It is also critically important to maintain sustained access to a high mix, low volume onshore semiconductor ecosystem that encompasses leading-edge electronics, state-of-practice, and legacy technologies.
Dennis M. Zogbi
Founder & CEO of Paumanok Publications
Talk Title:
Ultra-Low Loss & Precision Passive Components
for Quantum Computing: Market Opportunities & Technology Requirements 2025-2030
Dennis M. Zogbi is the founder and CEO of Paumanok Publications, Inc. (operating as Paumanok Industrial Market Research), and stands as the world's preeminent authority on passive electronic components. With 37 years of continuous market research (1988-2026) and authorship of more than 260 specialized reports, Zogbi has established himself as the electronics industry's most trusted voice on capacitors, resistors, inductors, circuit protection components, and their associated raw materials supply chains.
CMSE 2026 TUTORIALS
APRIL 28
Tuesday
CMSE 2026 LUNCH & LEARN SPEAKER
Ahmed Busnaina, Ph.D.
Chief Technology Officer
Talk Title:
High-throughput Additive Manufacturing of Microelectronics including Passive and Active Components for 3D HI, Legacy Electronics and Advanced Packaging
We introduce a new high throughput and scalable technique to additively manufacture nano and microelectronics. The technique eliminates etching, vacuum deposition, and other chemically intensive processing by utilizing direct assembly of nanoscale particles or other nanomaterials at room temperature and atmospheric pressure onto an interposer, wafer, or board. The presented technology enables the printing of crystalline conductors and semiconductors. The technology enables the additive manufacturing of passive and active components including logic gates at the nano and microscale using a purely additive (directed assembly enabled) process utilizing inorganic semiconductors, metals, and dielectrics nanoparticles.
CMSE 2026 TECHNICAL TALKS
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